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UV debonding adhesive (KY-6170B) for chip/silicon cutting

Category:

UV Adhesive

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Details

Product Application

Small size silicon wheat water cutting protection

 

Product Features

1. Super adhesion before UV, no glue residue on chip after UV
2. Strong hydrophobicity, high-speed cutting does not enter water
3. High cohesion before UV protects dimensional stability during cutting

 

Product structure

150μmPO
10μm UV adhesive
Release film

 

Product parameters