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UV debonding adhesive (KU-6080) for transfer process

Category:

UV Adhesive

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Details

Product Application

Chip reverse film shipping protection

 

Product Features

1. UV pre-adhesive to ensure successful chip transfer
2. Less long-term adhesion after attachment
3. Very low adhesion after UV, easy to peel off the chip

 

Product structure

75μmPET
10μm UV adhesive
Release film

 

Product parameters